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Title: The thickness and temperature dependent resistivity of thin copper films
Authors: Zhang, Wenqi
Brongersma, Sywert
Clarysse, Trudo
Wu, Wen
Vervoort, Iwan
Palmans, Roger
Hoflijk, Ilse
Bender, Hugo
Hui, W
Carbonell, Laure
Rosseel, Erik
Vandervorst, Wilfried
Maex, Karen
Issue Date: 2003
Conference: Advanced Metallization Conference - AMC location:Montreal, Canada date:21/10/03
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems

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