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|ITEM METADATA RECORD
|Title: ||The thickness and temperature dependent resistivity of thin copper films|
|Authors: ||Zhang, Wenqi|
|Issue Date: ||2003 |
|Conference: ||Advanced Metallization Conference - AMC location:Montreal, Canada date:21/10/03|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Electrical Engineering - miscellaneous|
Associated Section of ESAT - INSYS, Integrated Systems
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