Advanced Metallization Conference - AMC, Date: 2003/10/21 - 2003/10/23, Location: Montreal, Canada

Publication date: 2003-01-01
Pages: 219 - 224
ISSN: 1-55899-757-1
Publisher: MATERIALS RESEARCH SOCIETY

ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003)

Author:

Zhang, Wenqi
Brongersma, Sywert ; Clarysse, Trudo ; Wu, Wen ; Vervoort, Iwan ; Palmans, Roger ; Hoflijk, Ilse ; Bender, Hugo ; Hui, W ; Carbonell, Laure ; Rosseel, Erik ; Vandervorst, Wilfried ; Maex, Karen ; Ray, GW ; Smy, T ; Ohta, T ; Tsujimura, M

Keywords:

Science & Technology, Physical Sciences, Technology, Electrochemistry, Metallurgy & Metallurgical Engineering, Physics, Condensed Matter, Physics, ELECTRICAL-RESISTIVITY

Abstract:

The resistivity of thin copper films is characterized by both spreading resistance probe (SRP) and conventional four-point-probe (FPP) as a function of thickness and temperature. A strong increase in resistivity is observed by SRP and FPP measurements with decreasing the thickness. SRP also enables us to study the resistivity of ultra-thin films without the percolation effect, as all SRP data is obtained from a bevelled sample. The combination of SRP and FPP data obtained from a series of layers with different thickness agrees quite well with Mayadas-Shatzkes' grain boundary scattering model. This indicates that the strong increase in resistivity is dominated by grain boundary scattering. The in-situ resistivity measurements during anneal further demonstrate the temperature evolution of the resistivity of thin films, which is not linear and depends on both the film thickness and deposition methods. After thermal cycling the linear temperature dependence is recovered and is consistent with Matthiessen's rule. © 2004 Materials Research Society.