Title: Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Authors: Vakanas, George
Wang, Teng
Tatsumi, Koji
Marinissen, Erik Jan
Rebibis, Kenneth June
Cherman, Vladimir
Croes, Kristof
Hua, Fay
De Wolf, Ingrid
Beyne, Eric
Issue Date: 2014
Conference: TMS Annual Meeting & Exhibition location:San Diego, CA USA date:2014-02-16
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Supporting Services Campusmanagement Science, Engineering and Technology

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