Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Vakanas, George; Wang, Teng; Tatsumi, Koji; Marinissen, Erik Jan; Rebibis, Kenneth June; Cherman, Vladimir; Croes, Kristof; Hua, Fay; De Wolf, Ingrid; Beyne, Eric

TMS Annual Meeting & Exhibition, Date: 2014/01/01 - 2014/01/02, Location: San Diego, CA USA

Publication date: 2014-01-01

Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Author:

Vakanas, George

Wang, Teng ; Tatsumi, Koji ; Marinissen, Erik Jan ; Rebibis, Kenneth June ; Cherman, Vladimir ; Croes, Kristof ; Hua, Fay ; De Wolf, Ingrid ; Beyne, Eric