44th International Semiconductor Conference (CAS), Date: 2021/10/06 - 2021/10/08, Location: ELECTR NETWORK
Publication date:
2021-01-01
Pages:
121 -
124
Publisher:
IEEE
2021 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS)
Author:
Hiblot, Gaspard
Serbulova, Kateryna ; Hellings, Geert ; Chen, Shih-Hung
Keywords:
3D, back-side PDN, Engineering, Engineering, Electrical & Electronic, Latch-up, Science & Technology, Technology, thin substrate