Ieee Transactions On Components Packaging And Manufacturing Technology
Publication date:
2020-04-01
Volume:
10
Pages:
669 -
678
Publisher:
Institute of Electrical and Electronics Engineers
Author:
Hou, Lin
Derakhshandeh, Jaber ; Capuz, Giovanni ; Beyne, Eric ; De Wolf, Ingrid
Keywords:
Science & Technology, Technology, Engineering, Manufacturing, Engineering, Electrical & Electronic, Materials Science, Multidisciplinary, Engineering, Materials Science, Cobalt, insertion bonding, intermetallic compound (IMC), surface passivation, SN, RELIABILITY, 4009 Electronics, sensors and digital hardware, 4014 Manufacturing engineering