Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application
Publication date:
2019-03-04
ISSN:
9783527338559
Publisher:
John Wiley & Sons
Author:
Van der Perre, Liesbet
beyne, eric ; Catthoor, francky ; Agrawal, prashant ; Van der Plas, Geert ; Milojevic, Dragomir ; Raghavan, Praveen ; Velenis, Dimitrios ; Varadarajan, Ravi