Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects

Materials for Advanced Metallization - MAM, Date: 2013/01/01 - 2013/01/03, Location: Leuven Belgium

Publication date: 2013-01-01

Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects

Author:

Van Besien, Els

Singh, Arjun ; Barbarin, Yohan ; Verdonck, Patrick ; Baklanov, Mikhaïl