1st Int. IEEE workshop on low temperature bonding for 3D integration, Date: 2007/11/01 - 2007/11/01, Location: Tokyo, Japan
Publication date:
2007-11-01
Pages:
301 -
334
1st Int. IEEE workshop on low temperature bonding for 3D integration
Author:
De Moor, P
Ruythooren, W ; Soussan, P ; Baert, Kris ; Van Hoof, C ; Swinnen, B ; Beyne, E