Author:

Abstract:

This paper presents a novel experimental approach for thermal characterization of electronic components in a fluid bath. The purpose of this enhanced test method is to provide well-defined experimental boundary conditions which can be easily applied for validation of numerical models. After a brief review of issues relating to the traditional standard fluid bath test methods, the concept of submerged double jet impingement (SDJI) is introduced. The improvements obtained by the SDJI method are illustrated with practical measurement examples of quad flat packages. It is shown that the SDJI method provides an accurate and reproducible Rja-format for validation of thermal models. A prototype SDJI measurement set-up is presented and the convective boundary condition is quantified.