euspen2011, Date: 2011/05/23 - 2011/05/27, Location: Como
Publication date:
2011-05-23
Pages:
435 -
438
ISSN:
9780955308291
11th International Conference of euspen
Author:
Qian, Jun
Kersschot, Bruno ; Masolin, Alex ; Vaes, Jan ; Frederic, Dross ; Reynaerts, Dominiek ; Spaan, Henny ; Shore, Paul ; Van Brussel, Hendrik
Keywords:
Micro-EDM, Kerf loss, Solar cell, Silicon wafer
Abstract:
To reduce the kerf-loss in producing thin silicon wafers from an ingot, a stress-induced lift-off method (SLIM-Cut) has been recently developed. To enforce the crack initiation for lift-off and to control the wafer thickness in this method, micro-EDM processes have been experimented to generate small notches on crystalline silicon substrates. While the die-sinking EDM remains challenging and to be tuned, small notches of less than 30µm can be generated by the micro-EDM milling process.