IEEE Transactions On Device And Materials Reliability
Publication date:
2023-06-21
Volume:
23
Publisher:
Institute of Electrical and Electronics Engineers
Author:
Sangani, D
Diaz-Fortuny, Javier ; Bury, E ; Franco, J ; Kaczer, B ; Gielen, Georges
Keywords:
Science & Technology, Technology, Physical Sciences, Engineering, Electrical & Electronic, Physics, Applied, Engineering, Physics, BTI, HCI, circuit simulations, compact modeling, INSTABILITY, 0906 Electrical and Electronic Engineering, Applied Physics, 4008 Electrical engineering, 4009 Electronics, sensors and digital hardware