23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Date: 2022/04/25 - 2022/04/27, Location: MALTA, St Julian
Publication date:
2022-01-01
Publisher:
IEEE
2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME)
Author:
Nawghane, Chinmay
Vandevelde, Bart ; Labie, Riet ; Michiels, Sam ; Hughes, Danny ; Liu, Mengyao
Keywords:
Science & Technology, Life Sciences & Biomedicine, Technology, Biophysics, Engineering, Electrical & Electronic, Engineering