Title: The effect of cu on morphological instabilities in thin al/pt films
Authors: Colgan, Eg ×
Blanpain, Bart #
Issue Date: May-1992
Publisher: Materials research society
Series Title: Journal of materials research vol:7 issue:5 pages:1093-1095
Abstract: Al films deposited on Pt layers developed voids after annealing at 250-degrees-C. The amount of Al in the area surrounding the voids increased relative to the as-deposited film. The addition of 1 or 4% Cu to the Al suppressed the void formation and lateral Al migration. The void formation is related to compound formation with the Pt. The addition of Cu to the Al did not modify the Pt2Al3 formation.
ISSN: 0884-2914
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Chemical and Extractive Metallurgy Section (-)
× corresponding author
# (joint) last author

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