Title: Thermal cycling behaviors of a NiTiCu wire reinforced Kevlar/epoxy composite
Authors: Zheng, Yanjun # ×
Cui, Lishan #
Schrooten, Jan #
Issue Date: Nov-2005
Publisher: Elsevier science bv
Series Title: Materials letters vol:59 issue:26 pages:3287-3290
Abstract: Shape memory alloy (SMAs) composites are used as structural materials where adaptive functionality is necessary. Therefore the thermal cycling behavior of the SMA composites is an important aspect needs to be well understood. In this paper a NiTiCu wire reinforced Kevlar/epoxy composite was fabricated, and the A(s) temperature at which the composite starts to build up recovery stress, recovery stress level, and the stress rate K during thermal cycling were examined. Results showed that the recovery stress level decreased, the A(s) temperature and the K value increased with thermal cycling and stabilized after certain numbers of thermal cycle. (C) 2005 Elsevier B.V. All rights reserved.
ISSN: 0167-577X
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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