Title: Integration of InP/InGaAsP photodetectors onto silicon-on-insulator waveguide circuits
Authors: Roelkens, G ×
Brouckaert, J
Taillaert, D
Dumon, P
Bogaerts, Walter
Van Thourhout, D
Baets, R
Notzel, R
Smit, M #
Issue Date: Dec-2005
Publisher: Optical soc amer
Series Title: Optics express vol:13 issue:25 pages:10102-10108
Abstract: The integration of optical functionalities on a chip has been a long standing goal in the optical community. Given the call for more integration, Silicon-on-Insulator (SOI) is a material system of great interest. Although mature CMOS technology can be used for the fabrication of passive optical functionality, particular photonic functions like efficient light emission still require III-V semiconductors. We present the technology for heterogeneous integration of III-V semiconductor optical components and SOI passive optical components using benzocyclobutene (BCB) die to wafer bonding. InP/InGaAsP photodetectors on SOI waveguide circuits were fabricated. The developed process is compatible with the fabrication of InP/InGaAsP light emitters on SOI. (c) 2005 Optical Society of America.
ISSN: 1094-4087
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Centre for Nuclear Engineering
× corresponding author
# (joint) last author

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