Ultra clean processing of silicon surfaces v vol:92 pages:53-56
In this paper we present a simple technique that can be used to evaluate whether a sub Micron particle will deposit on an wafer surface that is immersed in a given liquid. It is based on measuring the particle surface concentration as function of immersion time. Two contributions must be distinguished: one from adsorption during the immersion step, and a second one by residue formation when liquid evaporates during the drying step. By comparing the experimental results with theoretical models for both contributions, information on the particle-substrate interaction can be extracted. This technique will first be demonstrated using small wafer pieces and subsequently with 200mm wafers using standard metrology and equipment.