Title: Electrical characterization of anodically bonded wafers
Authors: Cozma, A ×
Jakobsen, H
Puers, Robert #
Issue Date: Jun-1998
Publisher: Iop publishing ltd
Series Title: Journal of micromechanics and microengineering vol:8 issue:2 pages:69-73
Abstract: The anodic bonding of silicon with glass influences the electrical characteristics of the bonded silicon. This paper shows that the resistivity at the surface of the n-type silicon and the breakdown voltage of p-n junctions decrease, and that the leakage currents increase, as a result of the charging effects in the glass.
ISSN: 0960-1317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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