Journal of micromechanics and microengineering vol:10 issue:2 pages:181-188
In this work, some of the possibilities of focused ion beams for applications in microsystem technology are explored. Unlike most previous studies, the emphasis is on 'additive' techniques, i.e. localized maskless deposition of metals and insulators. More precisely, we will show the possibility of fabricating small three-dimensional structures, using focused ion beam deposition of silicon oxide. Deposition examples will show that the technique is most promising for small post-processing steps or prototyping, because of its high degree of flexibility. Furthermore, an investigation into the mechanical properties of the deposited material is presented. More specifically, the Young's modulus of the deposited silicon oxide is determined.