Soc microelectronics, electron components materials-midem
Informacije midem-journal of microelectronics electronic components and materials vol:36 issue:4 pages:190-196
Integrated Microsystems are essential enablers of a smart environment. Two important trends are increasing miniaturization and wireless and autonomous operation. The prominent ingredients of such wireless autonomous transducers are ultra-low power sensor readout architectures consuming microwatts of power, and powerMEMS or energy scavenging technology (generating microwatts of power). Miniaturised 'cubes' in the cm3 range have become possible by antenna integration and 3D Sip integration and packaging methods Truly unobtrusive integrated sensor systems require further downsizing to the mm3 range. This is envisaged by advanced 3D-packaging, and thin film integration of RF and MEMS components. For RF systems and RF-MEMS applications, IMEC's work is a generic extension of its current advanced packaging and interconnect technology RF platform For physical, kinematic as well as optical MEMS applications, a fully CMOS compatible generic above-IC polySiGe MEMS technology is presented. Examples of technology platforms will be given, including reliability of some demonstrated microsystems. Such extremely miniaturized systems will lend themselves to integration into flexible and even stretchable embodiments. This talk will summarize IMEC's efforts positioned within worldwide developments.