Title: Thermal-stability and interface bowing of submicron tisi2/polycrystalline silicon
Authors: Norstrom, H
Maex, Karen
Vanden Abeele, P #
Issue Date: Mar-1991
Publisher: Elsevier science sa lausanne
Series Title: Thin Solid Films vol:198 issue:1-2 pages:53-66
Abstract: The electrical integrity of submicron TiSi2/polycrystalline silicon (poly-Si) lines is investigated when they are subjected to furnace heat treatments at elevated temperatures.
ISSN: 0040-6090
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science