|ITEM METADATA RECORD
|Title: ||Thermal-stability and interface bowing of submicron tisi2/polycrystalline silicon|
|Authors: ||Norstrom, H|
Vanden Abeele, P #
|Issue Date: ||Mar-1991 |
|Publisher: ||Elsevier science sa lausanne|
|Series Title: ||Thin Solid Films vol:198 issue:1-2 pages:53-66|
|Abstract: ||The electrical integrity of submicron TiSi2/polycrystalline silicon (poly-Si) lines is investigated when they are subjected to furnace heat treatments at elevated temperatures.|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
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