|ITEM METADATA RECORD
|Title: ||Development of an Electroless Copper Deposition Bath for Via Fill Applications on TiN Seed Layers|
|Authors: ||Palmans, Roger|
|Issue Date: ||1994 |
|Conference: ||MRS Conference on Advanced Metallization for ULSI Applications; October 6-8, 1994; Austin, Texas, USA.|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
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