Title: Development of an Electroless Copper Deposition Bath for Via Fill Applications on TiN Seed Layers
Authors: Palmans, Roger
Maex, Karen
Issue Date: 1994
Conference: MRS Conference on Advanced Metallization for ULSI Applications; October 6-8, 1994; Austin, Texas, USA.
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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