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|ITEM METADATA RECORD
|Title: ||Temporary bonding and debonding for 3D applications|
|Authors: ||De Munck, Koen|
Sabuncuoglu Tezcan, Deniz
De Moor, Piet
Van Hoof, Chris
|Issue Date: ||2006 |
|Conference: ||2nd International Workshop on Wafer Bonding for MEMS technologies location:Leuven Belgium date:09/04/06|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Electrical Engineering - miscellaneous|
ESAT - ELECTA, Electrical Energy Computer Architectures
ESAT - MICAS, Microelectronics and Sensors
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