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Title: Temporary bonding and debonding for 3D applications
Authors: De Munck, Koen
Bogaerts, Lieve
Sabuncuoglu Tezcan, Deniz
Jourdain, Anne
De Moor, Piet
Swinnen, Bart
Baert, Kris
Van Hoof, Chris
Issue Date: 2006
Conference: 2nd International Workshop on Wafer Bonding for MEMS technologies location:Leuven Belgium date:09/04/06
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Electrical Engineering - miscellaneous
ESAT - ELECTA, Electrical Energy Computer Architectures
ESAT - MICAS, Microelectronics and Sensors

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