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Title: Wafer level temporary bonding/debonding for thin wafer handling applications
Authors: De Munck, Koen ×
Bogaerts, Lieve
Sabuncuoglu Tezcan, Deniz
De Moor, Piet
Swinnen, Bart
Baert, Kris
Van Hoof, Chris #
Issue Date: 2006
Conference: IMAPS International Conference and Exhibition on Device Packaging location:Leuven Belgium date:20/03/06
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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