This item still needs to be validated !
Title: Wafer level temporary bonding/debonding for thin wafer handling applications
Authors: De Munck, Koen ×
Bogaerts, Lieve
Sabuncuoglu Tezcan, Deniz
De Moor, Piet
Swinnen, Bart
Baert, Kris
Van Hoof, Chris #
Issue Date: 2006
Conference: IMAPS International Conference and Exhibition on Device Packaging location:Leuven Belgium date:20/03/06
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.