This item still needs to be validated !
Title: Effect of Cu on Al interfacial mass transport in bamboo RIE and damascene Al(Cu)
Authors: Proost, Joris ×
Li, H
Witvrouw, Ann
Maex, Karen #
Issue Date: 1999
Host Document: MRS Proceedings vol:563 pages:91-96
Conference: Materials Reliability in Microelectronics IX; 5-9 April 1999; San Francisco, Ca, USA. location:San Francisco, USA date:April 5-9, 1999
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science