Title: Roles of additive during filling process of damascene structures with electrochemical deposited copper
Authors: Richard, Emmanuel
Vervoort, Iwan
Brongersma, Sywert
Beyer, Gerald
Bender, Hugo
Palmans, Roger
Lagrange, Sébastien
Maex, Karen
Issue Date: 1999
Conference: Advanced Metallization Conference; location:Orlando, FL, USA. date:September 28-30, 1999
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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