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Title: Electrical and microstructural characterization of narrow Cu interconnects
Authors: Wu, Wen
Brongersma, Sywert
Vervoort, Iwan
Bender, Hugo
Van Hove, Marleen
Maex, Karen
Issue Date: 2003
Conference: Advanced Metallization Conference location:Montreal, Canada date:21/10/03
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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