Title: A modified electromigration test structure for flip chip interconnections
Authors: Labie, Riet ×
Webers, Tomas
Beyne, Eric
Mertens, Robert
Van Humbeeck, Jan #
Issue Date: 2006
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Components and Packaging Technologies vol:29 issue:3 pages:508-511
ISSN: 1521-3331
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
× corresponding author
# (joint) last author

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