ITEM METADATA RECORD
Title: Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
Authors: Labie, Riet ×
Ruythooren, Wouter
Van Humbeeck, Jan #
Issue Date: 2007
Publisher: Elsevier Applied Science
Series Title: Intermetallics vol:15 issue:3 pages:396-403
Abstract: The formation and growth rate of intermetallics of frequently used metallisation systems for flip-chip bumping have been studied and are reported for many years. However, no data are available on diffusion couples with flip-chip processing methods and actual flip-chip scale dimensions. In this paper, the interdiffusion coefficients and activation energies of Cu-Sn and Ni-Sn intermetallic formations are measured on flip-chip bumps with 40 µm bond pad diameter. Also the morphology of the metallurgical reactions is described. Furthermore, the ideal case of a binary diffusion system is seldom present in real-life. In practice, the presence of additional alloying elements has an impact on the intermetallic stoichiometry and even on intermetallic growth and morphology. It is shown that small quantities of Cu in a Ni-Sn system can have a beneficial effect on the Ni consumption but larger quantities result in extreme scalloping of the intermetallic interface.
ISSN: 0966-9795
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
× corresponding author
# (joint) last author

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