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Title: Grain growth in copper interconnect lines
Authors: Wu, Wen ×
Ernur, Didem
Brongersma, Sywert
Van Hove, Marleen
Maex, Karen #
Issue Date: 2004
Series Title: Microelectronic Engineering vol:76 issue:01/04/07 pages:190-194
ISSN: 0167-9317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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