Title: Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Authors: Gray, William
Loboda, M
Struyf, Herbert
Van Hove, Marleen
Donaton, R. A
Sleeckx, Erik
Stucchi, Michele
Gao, Teng
Boullart, Werner
Coenegrachts, Bart
Maenhoudt, Mireille
Vanhaelemeersch, Serge
Meynen, Herman
Maex, Karen
Issue Date: 2000
Conference: MRS Spring Meeting 2000. Symposium D: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; 2
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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