Title: Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers
Authors: Baumgart, H ×
Letavic, T. J
De Wolf, Ingrid
Maes, Herman
Egloff, R #
Issue Date: 1995
Host Document: pages:440-54
Conference: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications; May 21-26, 1995. Reno
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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