Title: Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Authors: Vandevelde, Bart ×
Beyne, Eric
Vandepitte, Dirk
Baelmans, Martine #
Issue Date: Sep-2004
Series Title: Journal of Electronic Packaging vol:126 issue:3 pages:351-358
ISSN: 1043-7398
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Applied Mechanics and Energy Conversion Section
Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

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