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Title: A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Authors: Lanckmans, Filip
Brongersma, Sywert
Varga, Istvan
Beyne, Eric
Maex, Karen
Issue Date: 2000
Conference: MRS Spring Meeting 2000. Symposium D: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; 2 location:Leuven Belgium
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems

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