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Title: High-density hybrid interconnect technologies
Authors: John, Joachim ×
Zimmermann, Lars
De Moor, Piet
De Munck, Koen
Borgers, Tom
Van Hoof, Chris #
Issue Date: 2004
Publisher: SPIE
Host Document: pages:1-8
Conference: Micro-Optics: Fabrication, Packaging, and Integration location:Leuven Belgium date:26/04/04
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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