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Title: Electrical and microstructural characterization of narrow Cu interconnects
Authors: Wu, Wen ×
Brongersma, Sywert
Vervoort, Iwan
Bender, Hugo
Van Hove, Marleen
Maex, Karen #
Issue Date: 2004
Publisher: MRS
Conference: Advanced Metallization Conference 2003 location:Montreal, Canada date:21/10/03
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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