Title: Roles of additives during filling process of damascene structures with electrochemical deposited copper
Authors: Richard, Emmanuel ×
Vervoort, Iwan
Brongersma, Sywert
Bender, Hugo
Beyer, Gerald
Palmans, Roger
Lagrange, Sébastien
Maex, Karen #
Issue Date: 2000
Host Document: pages:149-153
Conference: Advanced Metallization Conference 1999 (AMC 1999); location:Leuven Belgium
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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