|ITEM METADATA RECORD
|Title: ||Roles of additives during filling process of damascene structures with electrochemical deposited copper|
|Authors: ||Richard, Emmanuel ×|
Maex, Karen #
|Issue Date: ||2000 |
|Host Document: ||pages:149-153|
|Conference: ||Advanced Metallization Conference 1999 (AMC 1999); location:Leuven Belgium|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
× corresponding author|
# (joint) last author|
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