|ITEM METADATA RECORD
|Title: ||Development of an electroless copper deposition bath for via fill applications on TiN seed layers|
|Authors: ||Palmans, Roger ×|
Maex, Karen #
|Issue Date: ||1995 |
|Host Document: ||pages:87-94|
|Conference: ||Advanced Metallization for ULSI Applications in 1994;|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
× corresponding author|
# (joint) last author|
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