Title: Development of an electroless copper deposition bath for via fill applications on TiN seed layers
Authors: Palmans, Roger ×
Maex, Karen #
Issue Date: 1995
Host Document: pages:87-94
Conference: Advanced Metallization for ULSI Applications in 1994;
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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