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Title: Bias stress induced conduction mechanism evolution in silica based inter-metal dielectrics
Authors: Li, Yunlong ×
Groeseneken, Guido
Maex, Karen
Tokei, Zsolt #
Issue Date: 2006
Host Document: pages:20-23
Conference: 25th IEEE Integrated Reliability Workshop Final Report location:Leuven Belgium date:16/10/06
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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