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Title: Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
Authors: Chandrasekhar, Arun
Issue Date: 1-Oct-2004
Publisher: K.U.Leuven
Publication status: published
KU Leuven publication type: TH
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
Associated Section of ESAT - INSYS, Integrated Systems

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