|ITEM METADATA RECORD
|Title: ||Copper seed layer scaling for advanced interconnects: extendibility of I-PVD|
|Authors: ||Tokei, Zsolt|
|Issue Date: ||2002 |
|Conference: ||Advanced Metallization Conference location:San Diego, CA, USA date:01/10/02|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
|Files in This Item:
There are no files associated with this item.
Request a copy
All items in Lirias are protected by copyright, with all rights reserved.