Title: Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Authors: Tokei, Zsolt
Demuynck, Steven
Vervoort, Iwan
Mebarki, Bencherki
Mandrekar, T
Guggilla, S
Maex, Karen
Issue Date: 2002
Conference: Advanced Metallization Conference location:San Diego, CA, USA date:01/10/02
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems

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