Title: Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Authors: Ratchev, Petar
Carbonell, Laure
Ho, Meng
Bender, Hugo
De Wolf, Ingrid
Verlinden, Bert #
Issue Date: 2002
Conference: Proceedings 28th International Symposium for Testing and Failure Analysis - ISTFA location:Leuven Belgium date:03/11/02
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
Department of Materials Engineering - miscellaneous
# (joint) last author

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