ITEM METADATA RECORD
Title: Mechanical analysis of a SiLK/Cu dual damascene interconnect system
Authors: Waeterloos, Joost ×
Shaffer, E
Stokich, T
Alves Donaton, Ricardo
Maex, Karen #
Issue Date: 2001
Publisher: MRS
Host Document: pages:469-473
Conference: Advanced Metallization Conference 2000 date:03/10/00
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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