Author:

Keywords:

Science & Technology, Technology, Physical Sciences, Engineering, Electrical & Electronic, Nanoscience & Nanotechnology, Instruments & Instrumentation, Physics, Applied, Engineering, Science & Technology - Other Topics, Physics, FABRICATION, SILICON, 09 Engineering, 10 Technology, 40 Engineering

Abstract:

This paper reports on the first results of a study of the possibilities of the fabrication of micromechanical structures for microsystems applications in a regular MPC run of a standard CMOS process, followed by post-processing. Two post-processing modules, i.e., the frontside bulk etching module and the surface micromachining module are investigated. Examples of the former are suspended spiral coils for high-frequency applications and of the latter, metal bridge resonators.