|ITEM METADATA RECORD
|Title: ||Grain growth, stress, and impurities in electroplated copper|
|Authors: ||Brongersma, Sywert ×|
Maex, Karen #
|Issue Date: ||2002 |
|Series Title: ||Journal of Materials Research vol:17 issue:3 pages:582-589|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
× corresponding author|
# (joint) last author|
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