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Title: Barrier integrity effect on leakage mechanism and dielectric reliability of Copper/OSG interconnects
Authors: Li, Yunlong ×
Tokei, Zsolt
Mandrekar, T
Mebarki, Bencherki
Groeseneken, Guido
Maex, Karen #
Issue Date: 2005
Publisher: MRS
Conference: Materials, Technology, and Reliability of Interconnects location:San Francisco, CA, USA date:28/03/05
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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