|ITEM METADATA RECORD
|Title: ||Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections|
|Authors: ||De Wolf, Ingrid ×|
Maes, Herman #
|Issue Date: ||1997 |
|Host Document: ||pages:261-266|
|Conference: ||Proceedings of Micro.Mat '97; location:Leuven Belgium|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Associated Section of ESAT - INSYS, Integrated Systems|
× corresponding author|
# (joint) last author|
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