Title: Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections
Authors: De Wolf, Ingrid ×
Soper, A
Pozza, G
Ignat, M
Parat, G
Maes, Herman #
Issue Date: 1997
Host Document: pages:261-266
Conference: Proceedings of Micro.Mat '97; location:Leuven Belgium
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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