|ITEM METADATA RECORD
|Title: ||Thermo-mechanical analysis of flip chip on substrate bumps - assemblies|
|Authors: ||Vandevelde, Bart ×|
Allaert, K #
|Issue Date: ||1997 |
|Host Document: ||pages:603-606|
|Conference: ||Proceedings of the 11th European Microelectronics Conference - EMC '97; May 1997. Venice, Italy. location:Leuven Belgium|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Clinical Residents Dentistry|
× corresponding author|
# (joint) last author|
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