Title: Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Authors: Vandevelde, Bart ×
Christiaens, Filip
Beyne, Eric
Roggen, Jean
Peeters, Joris
Allaert, K #
Issue Date: 1997
Host Document: pages:603-606
Conference: Proceedings of the 11th European Microelectronics Conference - EMC '97; May 1997. Venice, Italy. location:Leuven Belgium
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Clinical Residents Dentistry
× corresponding author
# (joint) last author

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