|ITEM METADATA RECORD
|Title: ||Electroless nickel-gold stud bumping on laminate for flip-chip assembly|
|Authors: ||Zang, S|
De Baets, J
Van Calster, André
|Issue Date: ||1997 |
|Conference: ||Printed Circuit Board Technology; January 1997; Berlin, Germany.|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Clinical Residents Dentistry|
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