Title: Electroless nickel-gold stud bumping on laminate for flip-chip assembly
Authors: Zang, S
Vereecken, M
De Baets, J
Van Calster, André
Vervaet, A
Peeters, Joris
Allaert, K
Issue Date: 1997
Conference: Printed Circuit Board Technology; January 1997; Berlin, Germany.
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Clinical Residents Dentistry

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.