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Title: Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
Authors: Ernur, Didem ×
Wu, Wen
Brongersma, Sywert
Terzieva, Valentina
Maex, Karen #
Issue Date: 2004
Publisher: MRS
Conference: Advances in Chemical-Mechanical Polishing location:San Francisco, CA, USA date:12/04/04
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
× corresponding author
# (joint) last author

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